Siemens Digital Industries Software, in collaboration with Samsung Foundry, has made significant strides in the semiconductor industry by developing enhanced capabilities for advanced multi-die packaged designs. This collaboration is set to optimize various Electronic Design Automation (EDA) solutions, aligning with Samsung Foundry’s latest processes, to push the boundaries of 3D Integrated Circuit (3D-IC) manufacturability and other semiconductor technologies.
“Our expanded collaboration with Siemens EDA will help us deliver advanced design enablement solutions that address the evolving needs of our customers,” said Sungjae Lee, Vice President and head of Foundry PDK Development Team at Samsung Electronics. “By aligning our roadmaps and optimizing the entire design flow, we can drive advanced packaging innovation across key markets like 5G, automotive, and AI.”
Siemens and Samsung: boosting 3D-IC manufacturability
Significant technological advancements include the integration of Siemens’ Xpedition™ Substrate Integrator and Xpedition™ Package Designer software with Samsung’s technologies. This integration allows engineers to create comprehensive digital twin models of multi-die devices, enhancing design, analysis, verification, and signoff processes.
Moreover, Siemens’ digitally integrated High-Density Advanced Packaging (HDAP) flow has been successfully evaluated for Samsung’s multi-die-integration (MDI) packaging process. Tools like Siemens’ Calibre® xACT™ 3D software and Calibre xL parasitic extraction tools have received certification for use with Samsung’s most advanced process nodes. These tools are crucial for accurately extracting parasitics in complex 2.5D and 3D packaging configurations, supporting high bandwidth memory (HBM) channels on 3.5D silicon interposers.
Samsung certifies multiple Siemens EDA product lines and reference flows
The partnership has not only advanced technological capabilities but also brought multiple Siemens EDA product lines and reference flows up to speed with Samsung’s latest and greatest process technologies. Innovations such as AI-powered custom IC verification technologies and the Analog FastSPICE (AFS) platform have been adapted to enhance variation-aware verification and characterization, meeting the requirements of Samsung Foundry’s state-of-the-art fabrication processes.
In terms of sustainable solutions, the partnership has also led to the development of new design implementation solutions that enhance power structure robustness and reduce design cycle times. These solutions, including the Calibre DesignEnhancer, automate layout optimization tasks that align with the foundry’s rules to deliver clean design rule checking (DRC) results.
This robust collaboration underscores Siemens’ commitment to driving innovation and supporting the semiconductor industry’s growth through advanced solutions that meet the challenging requirements of modern IC design and fabrication. Mike Ellow, CEO of Silicon Systems for Siemens Digital Industries Software, emphasized the importance of synergy in this dynamic market: “Together, we’re working to deliver the power, performance, and area advantages of 3D-IC architectures for our mutual customers.”
Siemens Digital Industries Software continues to empower organizations with the tools needed to digitally transform, leveraging the Siemens Xcelerator platform to turn today’s ideas into tomorrow’s sustainable products. Through this partnership, Siemens and Samsung are setting new standards in the semiconductor industry, enhancing global competitiveness and innovation.
